Description
The DRY FILM LAMINATOR is a precision PCB fabrication machine designed for uniform and bubble-free lamination of dry film photoresist onto printed circuit boards. Engineered with controlled temperature, pressure, and smooth roller mechanisms, it ensures excellent adhesion and consistent coating quality—essential for high-resolution PCB pattern transfer.
Ideal for PCB manufacturing units, electronics R&D labs, engineering colleges, prototyping centers, and training institutes.
✅ Key Features
🔥 Controlled Heating System
Uniform temperature control for optimal dry film adhesion
Prevents film wrinkling, peeling, or overheating
Ensures consistent lamination quality across the PCB surface
🌀 Precision Roller Mechanism
High-quality silicone or rubber rollers (model dependent)
Uniform pressure distribution during lamination
Bubble-free and wrinkle-free photoresist application
⚙ Adjustable Speed & Pressure Control
Variable lamination speed for different PCB thicknesses
Adjustable roller pressure for precise film bonding
Suitable for single-sided and double-sided PCBs
🧱 Robust & Compact Construction
Rigid metal body for vibration-free operation
Corrosion-resistant structure for long service life
Compact footprint suitable for lab and workshop environments
🧪 Compatible with Various PCB Sizes
Supports standard PCB laminates
Works with common dry film photoresist materials
Suitable for prototype and small-batch PCB production
🛡 Safe & User-Friendly Operation
Thermal protection for safe operation
Simple control panel for easy handling
Student-safe design for academic labs
📘 Typical Applications
Dry film photoresist lamination for PCB fabrication
Preparation of PCB boards for UV exposure
Prototype PCB manufacturing
Electronics laboratory training
Educational and research PCB development
💡 Why Choose This Model?
Ensures uniform and high-quality photoresist lamination
Improves PCB pattern accuracy and yield
Easy to operate and maintain
Essential machine for professional and academic PCB fabrication










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